ASTM D352-1997(2008)e1 电绝缘用涂浆云母的标准试验方法
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时间:2024-04-25 22:19:24
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【英文标准名称】:StandardTestMethodsforPastedMicaUsedinElectricalInsulation
【原文标准名称】:电绝缘用涂浆云母的标准试验方法
【标准号】:ASTMD352-1997(2008)e1
【标准状态】:现行
【国别】:美国
【发布日期】:1997
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:D09.19
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:
【英文主题词】:bindercontent;bondedmicapaper;bondedmicasplittings;commutatorsegmentinsulation;compressivecreep;heaterplates;pastedmica;Bindercontent;Commutatorinsulation;Compressiontesting--electricalinsulatingmaterials;Creep;Dielectricbr
【摘要】:Thistestdeterminesthecompressivecreepunderlaboratoryconditionsorunderconditionsthatmaybeencounteredduringmanufactureofelectricalequipment.Ithasspecialsignificanceifthematerialtobetestedisappliedascommutatorsegmentinsulation.Itservesasameasureunderspecifiedconditionsoftheabilityofthematerialtoresistdeformationwhileundercompressiveload,duringexposuretoelevatedtemperatureforaspecifiedtime.Thistestissuitableforacceptancetestsandformanufacturingcontrol.1.1Thesetestmethodscoverthetestingofbondedmicasplittingsandbondedmicapapertobeusedforcommutatorinsulation,hotmolding,heaterplates,andothersimilarinsulatingpurposes.1.2Thesetestmethodsappearinthefollowingsections:Test
Sections
CompressiveCreep
4-10
DielectricStrength
38-41
MicaorBinderContent
19
MoldingTest
31-36
OrganicBinder
20-24
Resistivity
42-46
SiliconeBinder
25-30
StabilityUnderHeatandPressure
11-18
【原文标准名称】:电绝缘用涂浆云母的标准试验方法
【标准号】:ASTMD352-1997(2008)e1
【标准状态】:现行
【国别】:美国
【发布日期】:1997
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:D09.19
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:
【英文主题词】:bindercontent;bondedmicapaper;bondedmicasplittings;commutatorsegmentinsulation;compressivecreep;heaterplates;pastedmica;Bindercontent;Commutatorinsulation;Compressiontesting--electricalinsulatingmaterials;Creep;Dielectricbr
【摘要】:Thistestdeterminesthecompressivecreepunderlaboratoryconditionsorunderconditionsthatmaybeencounteredduringmanufactureofelectricalequipment.Ithasspecialsignificanceifthematerialtobetestedisappliedascommutatorsegmentinsulation.Itservesasameasureunderspecifiedconditionsoftheabilityofthematerialtoresistdeformationwhileundercompressiveload,duringexposuretoelevatedtemperatureforaspecifiedtime.Thistestissuitableforacceptancetestsandformanufacturingcontrol.1.1Thesetestmethodscoverthetestingofbondedmicasplittingsandbondedmicapapertobeusedforcommutatorinsulation,hotmolding,heaterplates,andothersimilarinsulatingpurposes.1.2Thesetestmethodsappearinthefollowingsections:Test
Sections
CompressiveCreep
4-10
DielectricStrength
38-41
MicaorBinderContent
19
MoldingTest
31-36
OrganicBinder
20-24
Resistivity
42-46
SiliconeBinder
25-30
StabilityUnderHeatandPressure
11-18
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